Polyimide Circuit Board

Resists high temperatures up to 572 f 300 c.

Polyimide circuit board.

Polyimide is a flexible polymeric film often used as a substrate for printed circuit boards. High temperature polyimide b 727 withstands wave solder environments and multiple harsh washes for printed circuit board and electronic component preprocess labeling. The military or defense pcbs use polyimide as a substrate. This is a broader category that includes many consumer focused goods that require circuit boards and.

33n is a flame retardant ul 94 vo polyimide laminate and prepreg system where the excellent high performance properties of polyimide need to be combined with flame retardance. In addition to their flexibility polyimide products are in high demand due to their tremendous heat resistance which results in their being used in everything from fuel cells to military applications as well as printed circuit boards. The thermal conductivity of this material is far better than that of the fr4 material. Isola is a leading global material sciences company that designs develops and manufactures laminate materials used to fabricate advanced multilayer printed circuit boards which provide the physical platforms for the semiconductors passive components and connection circuitry that power and control virtually all modern.

Polyimide occurs naturally in nature but can also be prepared synthetically. If you are planning to use your pcb in a high heat setting an fr4 board is probably not the best choice. It provides good mechanical strength and heat resistance to the pcb. Polyimide material is most commonly used in the flexible printed circuit boards.

Ultra durable adhesive is designed for use with extreme wash protocol and cleaning chemicals and is ideal for use in auto apply equipment. The polyimides that are used in the flex pcbs are generally imide monomer polyimides. It is known for its good thermal stability and chemical resistance values. Consumer electronics are not the same thing as computer electronics.

Flexible and rigid flex circuit boards are typically made out of polyimide and are generally preferred in applications where mobility and frequency of use are a primary concern. Withstands multiple cycles of harsh condition washes for printed circuit boards and electronic component preprocess labeling. High tg 250 c results in low overall processing and minimizes risk of latent pth defects in service. Amber high temperature polyimide with an ultra durable adhesive withstands the extreme wash protocol and cleaning chemicals used in printed circuit board manufacturing.

Polyimide isola offers a product line of polyimide based no flow prepreg materials for high temperature printed circuit applications these products consist of a flame resistant polyimide resin system suitable for military commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties.